AGC can make through vias in thin glass substrate by the patterns of customers’ requirements. AGC expects TGV substrate in the use of 3D integration for semiconductor packaging, and other wide variety of fields.


  • Substrate for Semiconductor Packaging and Glass Interposer
  • 3D Glass IPD
  • MEMS, Sensor Device
  • For the more connected world, we contribute to the miniaturization and acceleration of electronic devices through glass.


  • Miniaturization
  • It enables micro wiring with excellent flatness, shape stability, and through fine via of the glass.
  • High speed
  • It enables high speed and large capacity communication with excellent high frequency properties, through high insulation and low dielectric loss tangent of the glass.
  • High reliability
  • It is best suited to the semiconductor packaging with non-alkali glass and coefficient of thermal expansion close to Si.
  • High productivity
  • It can support a wafer, as well as a panel size.